EE403/503 COURSE POLICIES

Course Description and Objectives:

Students learn about plasma applications such as plasma deposition, plasma etching, gaseous electronics, gas lasers and plasma materials processing. Topics include basic atomic theory, elementary kinetic theory of gases, motion of charges in electric and magnetic fields, plasma properties, plasma generation and devices, plasma-surface interactions, electrodes and discharge characteristics, plasma diagnostics and plasma simulation.

Office:

• 215F Davis Hall
• Tel: 645-1030
• e-mail: etemadi@buffalo.edu
• Office Hours:
  -- Tuesdays 2:00 –3:00 p.m.
  -- Or By Appointment

Course Grade:

The course grade will be determined as follows:

Project	30%
Midterm	20%
Final	20%
Presentation	30%

Suggested Text Book and References:

BOOKS: 1- “Industrial Plasma Processing” by J Reece Roth, Institute of Physics Piblishing, ISBN 0-7503-0318-2, 1995.

2- “ Plasma Processing for Semiconductor Fabrication” by W. Nicholas G. Hitchon, Cambridge Unive Pr (Short); ISBN: 0521591759, 1999.

3- “Plasma Physics and Engineering” by A. Friedman and L. Kennedy, Taylor & Francis; ISBN: 1-560-32848-7