UB IE's 'Research Institute for Safety and Security in Transportation' conducts innovative research that combines human factors and technical expertise to better understand and improve quality performance in this critical endeavor. The center works closely with the FAA and Sandia National Laboratories.

Researchers in CSEE's Electronics Packaging Laboratory use laser Moire interferometry to measure submicron-scale deformation in solder joints that have been subjected to both elevated temperature and vibration. The lab is a world leader in creating damage mechanics models for electronics.