Researchers in CSEE's Electronics Packaging Laboratory use laser Moire interferometry to measure submicron-scale deformation in solder joints that have been subjected to both elevated temperature and vibration. The lab is a world leader in creating damage mechanics models for electronics.
Center for Unified Biometrics (CUBS)
CUBS is focused on advancing the fundamental science of biometrics and providing key enabling technologies to build engineered systems. UB researchers are taking a unified view of biometric technologies by integrating software algorithms for accurate identification of various biometrics and data analysis (informatics) with hardware acquisition devices.
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MAE's Automation, Robotics, and Mechatronics Laboratory is conducting research both on the theoretical formulation and experimental validation of such novel mechatronic systems as multi-robot collaboration.