Welcome UB Engineering Alumni, Friends, and Donors
The links below will connect you with the UB Engineering Alumni Association and with information on supporting UB Engineering.
UB Engineering Alumni Association
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Engineering EventsAll Events
Engineering Opening Day 
Researchers in CSEE's Electronics Packaging Laboratory use laser Moire interferometry to measure submicron-scale deformation in solder joints that have been subjected to both elevated temperature and vibration. The lab is a world leader in creating damage mechanics models for electronics. |