Message from the Director:
Since UB Engineering’s founding in 1946, faculty members have worked with students to provide area industry with engineering services. The opportunity to connect corporate partners with UB Engineering brainpower was elevated with the establishment of the Strategic Partnership for Industrial Resurgence (SPIR) program in 1994 and the naming of UB as a regional administrator.
SPIR, a State University of New York (SUNY) grant program, fills a gap in state industrial assistance programs through technically advanced, multidisciplinary assistance delivered on a fast turnaround basis to New York State companies. SPIR funds, which typically lower the project cost by 30 to 40 percent, provide access to staff, students and resources of UB’s seven schools of engineering.
SPIR is revitalizing and redirecting New York State industry by moving it toward an economy engaged in innovation and developing new technologies. Whether you are an entrepreneur seeking a way to bring your innovation to the next level, a small firm looking to upgrade or introduce new technologies, or a high-technology firm addressing the challenges of product development and testing, SPIR can help pay for these and many other initiatives to make your business more competitive. I invite you to learn more about the SPIR program and services available to businesses and citizens of New York State by contacting us at 716.645.8800.
Timothy Leyh, Executive Director
UB TCIE, under the aegis of UB’s School of Engineering and Applied Sciences, is the regional administrator for New York State’s Strategic Partnership for Industrial Resurgence (SPIR) program. The SPIR program offers an engineering resource that is unparalleled in New York State.
SPIR projects can help you:
UB's Great Lakes Program develops, evaluates, and synthesizes scientific and technical knowledge of the Great Lakes ecosystem. GLP researchers are working on the development and application of mathematical models to support understanding of a variety of Great Lakes basin issues.
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Researchers in CSEE's Electronics Packaging Laboratory use laser Moire interferometry to measure submicron-scale deformation in solder joints that have been subjected to both elevated temperature and vibration. The lab is a world leader in creating damage mechanics models for electronics.