Message from the Director:
Since UB Engineering’s founding in 1946, faculty members have worked with students to provide area industry with engineering solutions. The opportunity to connect corporate partners with UB Engineering brainpower was elevated with the establishment of the Strategic Partnership for Industrial Resurgence (SPIR) program in 1994 and the naming of UB as a regional administrator.
SPIR, a State University of New York (SUNY) grant program, fills a gap in state industrial assistance programs through technically advanced, multidisciplinary assistance delivered on a fast turnaround basis to New York State companies. Companies receiving SPIR funds – which typically average about one-third of the overall project cost – have access to more than 50 UB faculty engineers and applied scientists from the seven schools of engineering.
SPIR is revitalizing and redirecting New York State industry by moving it toward an economy engaged in innovation and developing new technologies. Whether you want to upgrade or introduce new technologies, address product development and testing challenges or enhance continuous improvement programs, SPIR makes your business more competitive.
I invite you to learn more about the SPIR program and services available to businesses and citizens of New York State by contacting us at 716.645.8800.
Timothy Leyh, Executive Director
UB TCIE, under the aegis of UB’s School of Engineering and Applied Sciences, is the regional administrator for New York State’s Strategic Partnership for Industrial Resurgence (SPIR) program. The SPIR program offers an engineering resource that is unparalleled in New York State.
Seven Ways SPIR Can Help Your Business
SPIR at UB Engineering Provides
A concept for solar cells for space-based electrical power under investigation by a UB EE researcher involves 5-10 micron thick microcrystalline Si films on flexible substrates topped with nanowires (shown here) that provide high optical absorption.
Multidisciplinary Center for Earthquake Engineering Research (MCEER)
MCEER is one of the foremost centers of its kind in the world. MCEER's overall goal is to enhance the seismic resiliency of communities through improved engineering and management tools for critical infrastructure systems, water supply, electric power, hospitals, transportation systems.
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Researchers in CSEE's Electronics Packaging Laboratory use laser Moire interferometry to measure submicron-scale deformation in solder joints that have been subjected to both elevated temperature and vibration. The lab is a world leader in creating damage mechanics models for electronics.