Tool for Quick Electromagnetic Characterization of High Current Interconnects

Advisor: Dr. DC Hopkins

Team size: 2-3

Technical Background

The interaction of high current, electrical interconnects conductors with themselves and surrounding ferromagnetic material affects the ac impedance and current flow patterns. Increased impedance causes greater resistance, which increases power loss (increasing heat and lowering efficiency), and causes greater inductance, which increases overshoot voltages and slows system response time.  This is a problem when supplying power to high-speed microprocessor systems or high power motor drive systems.

Primary Goal

• Develop a software tool to provide quick electromagnetic characterization of a high current interconnect system.

 

Problem Statement

 

• An interconnect manufacturer has potential customers that design their own bus-bar configurations and, consequently, over design to compensate for their lack of technical expertise. The interconnect manufacturer finds it difficult to demonstrate a better solution because the potential customers have a lack of interest or sophistication in understanding.
• The interconnect manufacturer needs information to
• capture the customer’s attention,
• demonstrate shortcomings in the customer’s designs, and
• demonstrate a better solution.

 

• Customers expect the interconnect manufacturer to supply an electromagnetic map and electrical characterization of a proposed bus bar solution.
• The interconnect manufacturer’s competitors supply an electromagnetic characterization to potential customers as part of a typical sales package.
• Potential customers need a quick response to product inquiries.

 

Objectives

 

• Develop a software interface for collecting user information
• Develop a means to quickly simulate a given interconnect structure
• Target information to customers’ needs and understanding
• Warehouse information to support a future library resource