|
|
Researchers in CSEE's Electronics Packaging Laboratory use laser Moire interferometry to measure submicron-scale deformation in solder joints that have been subjected to both elevated temperature and vibration. The lab is a world leader in creating damage mechanics models for electronics. 
Research Institute for Safety and Security in Transportation (RISST) RISST, established jointly by the University at Buffalo and the Transportation Security Administration (TSA), is a resource to the aviation community for improving human factors aspects of security and maintenance system performance.  Engineering EventsAll Events
Engineering Code of Professional Conduct |